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Infineon FF400R07KE4 IGBT Module

IGBT Module VCES=650V ICnom=400A /ICRM=800A

· Categories: IGBT Module
· Manufacturer: Infineon
· Price: US$ 70
· Date Code: 2021
. Available Qty: 404
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FF400R07KE4 Specification

the FF400R07KE4 an IGBT (Insulated Gate Bipolar Transistor) module. These ratings define the limits beyond which the device's operation may become unreliable or even permanently damaged. Here's a breakdown of the values:

  • Collector-Emitter Voltage (VCES): 650 Volts

    • The maximum voltage that can be applied between the collector and emitter terminals with the gate disconnected (VGE = 0V).

  • Gate-Emitter Voltage (VGES): ±20 Volts

    • The maximum voltage that can be applied between the gate and emitter terminals with the collector disconnected (VCE = 0V). It's important to note that this device is likely designed for use with positive and negative gate voltages.

  • Collector Current (DC, TC = 125°C) (IC): 400 Amperes

    • The maximum continuous collector current that the device can handle when the case temperature is at 125°C.

  • Collector Current (Pulse, Repetitive) (ICRM): 800 Amperes

    • The maximum repetitive pulse collector current that the device can handle.

  • Total Power Dissipation (TC = 25°C) (Ptot): 1250 Watts

    • The maximum power that the device can dissipate without exceeding its temperature limits when the case temperature is at 25°C.

  • Isolation Voltage (Visol): 2500 Volts

    • The isolation voltage between the device terminals and the baseplate. This is the maximum allowable voltage difference between these two sets of terminals.

  • Maximum Junction Temperature (Tj(max)): 175 °C

    • The maximum temperature that the device's internal junction can reach during operation. Exceeding this temperature can lead to device degradation.

  • Maximum Case Temperature (TC(max)): 125 °C

    • The maximum allowable temperature of the device's case during operation.

  • Operating Junction Temperature (Tj(op)): -40 to +150 °C

    • The recommended range of operating temperatures for the device's internal junction.

  • Storage Temperature (Tstg): -40 to +125 °C

    • The recommended range of storage temperatures for the device when it's not in operation.

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