ON MAC97A4G IGBT Module

Designed for use in solid state relays, MPU interface, TTL logic and any other light industrial or consumer application. Supplied in an inexpensive TO−92 package which is readily adaptable for use in automatic insertion equipment.

Features

•One−Piece, Injection−Molded Package

•Blocking Voltage to 600Volts

•Sensitive Gate Triggering in Four Trigger Modes (Quadrants) for allpossible Combinations of Trigger Sources, and especially for Circuitsthat Source Gate Drives

•All Diffused and Glassivated Junctions for Maximum Uniformity ofParameters and Reliability

•These are Pb−Free Devices*

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Peak Repetitive Off-State Voltage VRRM 200V

On-State RMS CurrentFull Cycle Sine Wave 50 to 60 Hz(TC = +50°C) IT(RMS) 0.6A

Peak Non−Repetitive Surge Current One Full Cycle, Sine Wave 60 Hz(TC= 110°C) ITSM 8.0A

Circuit Fusing Considerations (t = 8.3 ms) I2t 0.26 A2s

Peak Gate Voltage (t v 2.0 ms, TC = +80°C) VGM 5.0V

Peak Gate Power(t v 2.0 ms, TC = +80°C) PGM 5.0W

Average Gate Power(TC = 80°C, t v 8.3 ms) PG(AV) 0.1W

Peak Gate Current(t v 2.0 ms, TC = +80°C) IGM 1.0A

Operating Junction Temperature Range TJ -40 to +110°C

Storage Temperature Range Tstg -40 to +150°C

Thermal Resistance, Junction−to−Case RqJC 75°C/W

Thermal Resistance, Junction−to−Ambient RqJA 200°C/W

Maximum Lead Temperature for Soldering Purposes for 10 Seconds TL 260°C