Melexis adds ToF sensor with ASIL or SIL certification

The device has physical 307kpixel spatial resolution. Key use cases for this sensor are dynamic airbag suppression (so that airbags are not deployed unnecessarily), driver attention monitoring and close-range exterior LiDAR.

It can also be employed to provide safety perimeters for industrial cameras, for supporting the control of robots’ movements and for enabling more advanced machine vision.

Pivotal to the MLX75027RTI is a back-side illuminated (BSI) imaging technology. It combines Melexis automotive expertise with Sony’s proprietary DepthSense® ToF pixel. The MLX75027RTI delivers an exceptional 135 depth frames per second.

This sensor package is significantly smaller than our current generation device, resulting in 50% reduction in size. Consequently, more compact imaging systems can be developed. Optimization of the chief ray angle of the integrated MLA (Micro Lens Array) simplifies the overall optical system. The new MLX75027 is available in both automotive and industrial variants.

The MLX75027RTI is designed for automotive usage and features a -40˚C to +105˚C temperature range, while the MLX75027STI is for industrial applications with a -20˚C to +85˚C temperature range.

Another feature of the MLX75027 family is its proven sunlight robustness, meaning the signal quality is not affected by the external environment.

To help engineers with designing and implementing their ASIL/SIL systems, Melexis provides dedicated safety integration guidelines.

“The emerging NCAP regulations will boost the use of in-cabin monitoring for safety applications. It will become increasingly essential in industrial and mass market applications too,” states Gualtiero Bagnuoli, Optical Sensors Marketing Manager at Melexis. “Our time-of-flight sensor family is already broadly used. Now, with the introduction of the MLX75027RTI, we support system-level functional safety integrations.”

More at www.melexis.com/MLX75027 or via sales@melexis.com.