Molex overcomes connector packaging challenges with cutting-edge design solutions

“As the semiconductor industry continues to evolve and progress, the manufacturing system has also gone all out to meet this change, aiming to meet the extremely challenging technical and commercial requirements of the industry. Major electrical manufacturing solution providers (EMS) are currently leaning towards full automation to serve their customers better and faster. A major challenge for original equipment manufacturers (OEMs) and EMS providers is to package semiconductor components without causing damage to the product.

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As the semiconductor industry continues to evolve and progress, the manufacturing system has also gone all out to meet this change, aiming to meet the extremely challenging technical and commercial requirements of the industry. Major electrical manufacturing solution providers (EMS) are currently leaning towards full automation to serve their customers better and faster. A major challenge for original equipment manufacturers (OEMs) and EMS providers is to package semiconductor components without causing damage to the product.

Molex offers a variety of solutions for current packaging methods to meet the changing needs of the industry. Recently developed Surface Mount Compatible (SMC) connectors are now available in a number of different packaging methods for direct use on automated placement equipment. Molex’s manufacturing flexibility and excellent engineering quality in packaging allow Molex to develop customized packaging solutions for a wide range of OEM/EMS customers to meet their automation needs.

For any product-based industry, precise package design is very important in order to maintain product quality. In the connector industry, precision package design can provide great convenience for workers and forklift transportation. The benefits of automation include:

• Reduced risk of injury due to reduced human effort

• Automates the packaging process to increase production speed.

• Helps reduce machine downtime.

• Increase sales and reduce total cost of production.

Most traditional connector packaging operations involve a variety of bags and pallets. Although the fittings are simpler to package and ship, there is a risk of damage during shipping and extended downtime during assembly at the customer’s facility. Some of the newer packaging methods are faster to unpack, easier to operate, can be configured according to the needs of different customers, and can provide assistance with different automation technologies. Here are some commonly used advanced packaging methods:

1. Tape and Reel

Tape and Reel This packaging process is primarily used in surface mount equipment to load connectors into each bag inside the packaging tape or conveyor tape. In the tape-and-reel method, the connectors are placed in precisely designed bags that are pressed on plastic conveyor tape. The top tape seals on the conveyor tape to protect these components in the correct position. A row of positioning holes is provided along one edge of the embossed tape for positive indexing.

2. Tray packaging

Packaging in tray form provides safe storage and transport for larger parts that are not suitable for tape and reel packaging. Compared to bulk packaging, where connectors are loosely placed together in a bag or box, pallet packaging is a unique design that is often used to improve safety during shipping. Tray packaging also provides more efficient placement on the printed circuit board.

3. Hard tray

Thermoformed pallets are not suitable for certain situations due to their low durability, which can cause pallet damage. Soft pallets may sometimes not be able to withstand the weight of the pick and place robot arm. In this case, injection-molded rigid pallets are used. This method of encapsulation increases manufacturing costs and is only recommended in cases where flexible trays are ineffective.

4. Tube packaging

Hollow cylindrical packaging containers made of cardboard, plastic or aluminum are called tubular containers. Tube packaging is similar to the tape and reel method and is suitable for the safe storage and transportation of larger sized parts that are not entirely suitable for tape and reel packaging. According to this method, groups of components are placed in tubing isolated from the environment.

The increasing demand for Electronic components in manufacturing sectors including automotive, consumer electronics, medical devices, and industrial automation is expected to contribute significantly to the market growth in the near future.

In addition, growing preference for electric vehicles in major economies including Germany and China C Owing to the emphasis on harmful emissions, this is expected to drive the demand for passive components, thus boosting the market growth.

Molex offers a variety of different types of packaging, such as ESD bulk packaging, tube packaging, tray packaging, and tape and reel versions, all of which aid automation and help reduce costs. This simplifies the assembly process by assisting electronic component manufacturers around the world to obtain the required components in the proper packaging.

As an authorized Molex distributor, Heilind can provide relevant service and support to the market. In addition, Heilind also supplies products from many of the world’s top manufacturers, covering 25 different component categories, and focusing on all market segments and all customers, Constantly seeking a broad product offering to cover all markets.