18A is scheduled to be “manufacturing ready” in 2024 and is billed as the node which overtakes TSMC’s process technology.
Nvidia, Qualcomm, Microsoft, IBM, Cadence and Synopsys are also engaged in the programme and helping to develop 18A test chips. 18A process development “continues on track”, says Intel.
The programme to facilitate early access to advanced foundry processes was developed by the US Department of Defence and has three strings to its bow:
RAMP (Rapid Assured Microelectronics Prototypes);
RAMP-C – where ‘C’ stands for Commercial; and
SHIP (State-of-the-art Heterogeneous Integration Prototype) for packaging.