The SanRex PK250HB160 and Infineon FS450R12KE3 are high-performance IGBT modules designed for demanding industrial applications.
The SanRex PK250HB160 is a robust 1600V, 250A IGBT module designed for various industrial and power control systems. It is suitable for high-power applications, including AC/DC motor drives, heating control systems, and static switches.
This module’s high thermal performance and efficient switching characteristics make it ideal for use in industrial power systems where reliability and efficiency are critical(Shunlongwei).
The Infineon FS450R12KE3 is a 1200V, 450A IGBT module that belongs to the EconoPACK™+ series. It features TRENCHSTOP™ IGBT3 technology, which ensures high power density and excellent thermal performance, especially in compact inverter designs.
The FS450R12KE3 also offers ease of assembly and high reliability due to its plug-free design. Its excellent thermal resistance between the case and heatsink ensures optimal performance under heavy loads.
Parameter | SanRex PK250HB160 | Infineon FS450R12KE3 |
---|---|---|
Collector-Emitter Voltage (V) | 1600V | 1200V |
Collector Current (IC) | 250A | 450A |
Power Dissipation (Pd) | 1700W | 2.1kW |
Operating Temperature | -40°C to +150°C | -40°C to +125°C |
Package Type | Standard module with mounting | EconoPACK+ compact design |
Applications | Motor control, inverters, heating | Motor drives, UPS, solar, vehicles |
Notable Features | High thermal performance | High power density, plug-free design |
Both the SanRex PK250HB160 and Infineon FS450R12KE3 are excellent choices for high-power industrial applications, offering reliability, efficiency, and robust thermal management. The PK250HB160 is ideal for applications requiring higher voltage (1600V) and moderate current (250A), while the FS450R12KE3 is more suitable for applications that prioritize higher current (450A) and compact, efficient design solutions such as inverters and motor drives. When choosing between these modules, it’s crucial to consider the specific power requirements, thermal management needs, and space constraints of the target application.