Texas Instruments: Learn about 5 technical points about TI BAW technology

“Wireless technology is the backbone of the rapidly evolving Internet world. As these technologies have greatly increased the requirements for communication speed, communication distance, and integration, developers and manufacturers are looking for solutions that can simplify the design of the Internet of Things (IoT).

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Wireless technology is the backbone of the rapidly evolving Internet world. As these technologies have greatly increased the requirements for communication speed, communication distance, and integration, developers and manufacturers are looking for solutions that can simplify the design of the Internet of Things (IoT).

5 technical points of BAW technology

Texas Instruments (TI) innovative technology-bulk acoustic wave (BAW) resonator-by providing the industry’s advanced crystal-free SimpleLink^TMThe wireless microcontroller (MCU) makes integration a step forward. TI BAW resonator technology makes high-performance, high-precision resonators possible. When integrated into the MCU package, no external quartz crystal is required, and key performance such as power consumption, delay or frequency stability will not be affected.

The following are five technical points to understand TI BAW resonator technology:

1. What is Bulk Acoustic Wave (BAW) technology?

BAW is a micro-resonator technology that can directly integrate high-precision and ultra-low jitter clocks into packages containing other Circuits. BAW technology equipment is smaller than external quartz crystal equipment-it can provide lower noise wired and wireless network signals. From wireless consumer Electronic products to high-end industrial systems, it provides higher-quality communications and higher efficiency for various fields.

2. How does TI BAW technology work?

TI BAW technology is a key technology based on integrated microelectromechanical (MEMS) on-chip resonators, which consist of piezoelectric materials sandwiched between two electrodes. This material can convert electrical energy into mechanical sound energy, generate reliable oscillations, and generate high-frequency, stable clock output. Then, the stable clock can be used as a reference source for radio frequency (RF) timing to make the radio core operate reliably, while at the same time, it also has high frequency error and temperature drift performance.

Figure 1: Piezoelectric materials used as resonators (a); TI BAW technology integrated on silicon wafers (b)

3. What are the advantages of TI BAW technology?

TI BAW technology supports the industry’s advanced MCU without external quartz crystal oscillator, which can achieve reliable, high-performance and high-precision timing. With a simplified design based on the highly integrated wireless CC2652RB MCU, TI BAW technology can help reduce the overall design footprint and development cost. In addition, you can also enjoy more options and greater flexibility for designing in a wider range of applications and environments.

4. How does TI BAW technology improve design?

Innovative chips from TI BAW technology can be used to reduce bill of materials (BOM) costs, improve network performance, and improve vibration and shock capabilities in next-generation industrial and telecommunications applications, including data transmission, building and factory automation, and grid infrastructure equipment.

From agriculture to factories, this technology can be used to develop higher-performance systems while minimizing system cost, size and design complexity.

5. How to learn more about TI BAW technology and start using it to develop technology?

You can visit www.ti.com/baw and browse all new content related to TI BAW technology. Pre-production samples of CC2652RB are now available in the TI store in a 7 mm×7 mm QFN package, or you can start using the TI LaunchPad based on the SimpleLink CC2652B wireless MCU through the TI store^TMDevelopment kit.

The CC2652RB device supporting TI BAW technology is part of TI’s SimpleLink platform, providing the broadest combination of wired and wireless Arm®MCU (system on chip) products in a single software development environment-SimpleLink SDK. The pre-production CC2652RB device currently supports Bluetooth Low Energy 5.0, and future versions are planned to include Zigbee 3.0 and Thread support.