Thermal interface material flows fast for production

Called GEL 60HF (HF = high flow), long-term thermal stability is claimed by the company, as are properties suited to re-work and field repair.

“The paste-like consistency enables tightly controlled dispensing and accurate material placement during assembly,” it said. “Notably, the product requires low compressive force to deflect under assembly pressure, minimising stress on components, soldered joints and PCB leads.”

It is a pre-cured single-component gel that can be stored and transported at room temperature and with a one year shelf-life from manufacture. A multitude of packages suited to automated dispensing are available, from 10cc (pictured) to 7.5 litre.

“Mobile phone manufacturers with short takt times can achieve up to 100g/min alongside good wetting-out properties that adhere well to the substrate in support of fast dwell times,” added Chomerics marketing manager Ben Nudelman. “Throughput of several hundred pieces per hour is possible.”

While Nudelman said 100g/minute, the figure according to the data sheet and product page is 80g/minute.

Thermal conductivity is 6.2W/mK and operation is over -55 to 200°C, with 150ppm/K expansion. Typical minimum bond-line thickness is 0.15mm.

Electrically: resistivity is 10¹³Ωcm, dielectric strength 5kVac/mm and it has a dielectric constant of ~4.8 and ~0.002 dissipation factor – the last two at 1MHz 0.5mm.

Applications are foreseen in consumer electronics, telecommunications equipment, energy storage devices, power supplies, automotive control units, automotive sensors, CPUs and GPUs.

The product page can be found here , the data sheet here, and there is a reliability report