What are the advantages of incorporating a MEMS resonator into an IC by using a WLCSP using silicon?

“By adopting the WLCSP using silicon material, the MEMS resonator has high compatibility with the semiconductor IC chip of the same material at the time of mounting, and can be built into the IC. What are the features and advantages of such a MEMS resonator? Murata’s technical white paper “Ultra Small MEMS Resonator” gives you the answer~

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By adopting the WLCSP using silicon material, the MEMS resonator has high compatibility with the semiconductor IC chip of the same material at the time of mounting, and can be built into the IC. What are the features and advantages of such a MEMS resonator? Murata’s technical white paper “Ultra Small MEMS Resonator” gives you the answer~

This white paper details the value that comes from being built into the IC.

Murata’s MEMS resonators use silicon material, so compatibility with ICs is excellent, and by achieving ultra-small size, it can be built into ICs.

By building the 32k resonator into the IC, IC manufacturers no longer have to provide technical support for the resonator and help simplify the circuit for the end user.

By using WLCSP using silicon material, it has high compatibility with semiconductor IC chips of the same material when mounted, and its height is reduced by 30% compared with conventional crystal resonators, and the product height is 0.35 mm, So it can be built into IC.

Murata’s 32kHz resonator adopts a WLCSP structure using silicon material, so it has excellent molding voltage resistance.

Compared with a conventional crystal resonator, the package displacement when fabricated with a mold can be suppressed to about 1/100, and high-voltage transfer molding can be supported. The figure above is the result of the molding simulation (simulation conditions: the molding resin is epoxy resin, and the molding pressure is 19MPa).

Click to download the white paper: https://www.murata.com/en-us/products/timingdevice/mems-r/mems-r-whitepa…